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Semiconductor Material

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Mold cleaning paper

                                    

   Mold cleaning paper is developed to instead of the traditional metal frame or substrat for mold clean of electrical elements in order to largely decrease the production cost for client.


Characteristics：

 

 1. Don’t need to change mold temperature and other parameters.

  2. Easy to move from the surface of mold.

  3. No brightness and resin flood.

  4 .Easy to control stock.

  5. Don’t need distinguish mold material( steel, nickel, alloy and others.

  6. Non causticity.




 

 

 

 

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