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Semiconductor Material

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Epoxy Molding Compound

It is a powdery molding compound made from epoxy resin as a matrix resin, high-performance phenolic resin as a curing agent, siliconpowder, and other fillers, as well as various additives.

More than 90% of plastic packaging (referred to as plastic packaging) materials use EMC. The plastic packaging process involves using transfer molding to squeeze EMC into the mold cavity and embed the semiconductor chips therein, while cross-linking and solidifying to form a semiconductor device with a structural appearance.